Low Pressure Molding Solution for Electronics Protection
From connectors and sensors to EV batteries and medical devices — GLUMOLD low pressure molding (LPM) machine provides the machines, materials, mold design, and process expertise to protect your most sensitive electronic assemblies.
1. What is Low Pressure Molding (LPM)?
Low Pressure Molding is a specialized encapsulation process that uses thermoplastic hot-melt materials — primarily polyamide and polyolefin compounds — to gently encase and protect electronic components. Unlike conventional injection molding which operates at high pressures (500–2000 bar) that would destroy delicate electronics, a low pressure molding machine injects material at just 1.5–40 bar, allowing safe encapsulation of even the most sensitive PCB assemblies, MEMS sensors, and fine wire connections.
The process is fast (cycle times as low as 30 seconds), cost-effective (aluminum tooling instead of steel), and environmentally friendly (solvent-free, VOC-free, reworkable materials). It serves as a superior alternative to traditional potting, conformal coating, and heat-shrink tubing — combining the protection of all three into a single streamlined step.
How It Works — 3 Simple Steps
Where conventional potting can require up to seven process steps and 24-hour cure times, the entire LPM machine process can be completed in three steps:
- Load: Place the unprotected component (PCB, connector assembly, sensor module) into a precision aluminum mold.
- Inject: The low pressure molding machine heats the thermoplastic material to 180–240°C and injects it into the mold cavity at low pressure. The material flows gently around all components, filling every gap.
- Eject: Within seconds, the material solidifies. The finished, fully-protected part is ejected from the mold — immediately ready for testing and handling.
2. Why Choose a Low Pressure Molding Machine?
Compared to potting with epoxy resins, conformal coating, or high-pressure injection molding, LPM machines offer a unique combination of benefits that make them the preferred choice for electronics encapsulation across industries:
- Gentle on Electronics: Injection pressure of 1.5–40 bar protects sensitive components — PCBs, solder joints, MEMS sensors, and fine wire bonds remain undamaged during the encapsulation process.
- Watertight Protection: Achieves IP67, IP68, and even IP69K sealing ratings, protecting against moisture, dust, chemicals, and temperature extremes from -50°C to +160°C.
- Fast Cycle Time: Complete encapsulation in 20–45 seconds per cycle. No overnight curing required — parts are immediately testable after ejection.
- Low Tooling Cost: Aluminum molds (7075 grade) cost a fraction of steel injection molds, with lead times measured in days rather than weeks.
- Housing Elimination: The molded material itself becomes the housing, eliminating the need for separate plastic enclosures — reducing part count, inventory, and assembly time.
- Sustainable Materials: GLUMOLD materials are plant-based, VOC-free, REACH and RoHS compliant, reworkable, and recyclable.
- Strain Relief Built In: Creates mechanical bonding around wires and cables, providing integrated strain relief without additional components.
3. Low Pressure Molding Applications — What Can You Protect with an LPM Machine?
The versatility of low pressure molding machines makes them suitable for virtually any application where sensitive electronics need environmental protection. Below are the most common applications, each with specific encapsulation requirements that GLUMOLD solutions address.
3.1. LPM for Connectors & Wire Harnesses
Low pressure molding was originally developed for sealing connectors and creating strain reliefs for wires — and it remains one of the most popular applications today. The process creates a watertight, mechanically bonded seal around connector interfaces, protecting solder joints and wire entry points from moisture ingress, vibration fatigue, and chemical exposure. Ideal for automotive connectors, industrial Deutsch connectors, waterproof cable assemblies, and multi-pin harness terminations.
Recommend for: Automotive · Industrial · Telecom
3.2. LPM for Sensors & Transducers
Automotive sensors (tire pressure, temperature, proximity, oxygen), industrial IoT sensors, and environmental monitoring devices all require reliable protection in harsh operating conditions. A low pressure molding machine encapsulates sensor modules without damaging the sensing element, maintaining calibration accuracy while providing IP68-level sealing against moisture, road chemicals, engine vibration, and thermal cycling from -40°C to +150°C.
Recommend for: Automotive · IoT · Industrial
3.3. LPM for PCB Assemblies & ECU Modules
Printed circuit board assemblies — including ECU (Electronic Control Unit) modules, motor control boards, and power management circuits — benefit from full-body encapsulation that protects all surface-mount components, through-hole connections, and trace routes simultaneously. LPM replaces the traditional combination of conformal coating + potting + separate housing with a single molding step.
Recommend for: Electronics · Automotive · Defense
3.4. LPM for LED Modules & Lighting Electronics
LED driver circuits, flexible PCB (FPCB) LED strips, and lighting control modules require encapsulation that provides thermal management and moisture protection while allowing light transmission where needed. GLUMOLD materials can be applied with controlled thickness over optical windows, and the low injection pressure ensures LEDs and solder joints are not displaced during molding.
Recommend for: Lighting · Signage · Automotive
3.5. LPM for Battery Packs & Energy Storage
Battery management systems (BMS), lithium-ion and LiPo cell assemblies, and EV battery module connections require gentle encapsulation at lower temperatures to avoid triggering thermal events. GLUMOLD material grade HM3312 features a low softening point of 130°C, making it specifically designed for heat-sensitive battery applications. The encapsulation provides mechanical protection, electrical insulation, and moisture sealing for battery assemblies used in EVs, power tools, and portable electronics.
Recommend for: EV · Power Tools · Consumer Electronics
3.6. LPM for Medical & Wearable Devices
Patient monitoring sensors, wearable biosensors, surgical instrument electronics, and implantable device connections demand encapsulation that meets biocompatibility standards while providing reliable sealing against body fluids and sterilization chemicals. Low pressure molding delivers hermetic-level sealing in a compact, lightweight form factor — essential for devices that must be worn continuously or operate inside the body.
Recommend for: Medical · Wearables · Diagnostics
3.7. LPM for RFID Tags & Smart Labels
RFID transponders, NFC tags, and smart label circuits are extremely thin and fragile — traditional protection methods are too bulky or too rough for these applications. LPM encapsulation adds minimal thickness (as low as 1mm with Skylining Technology) while providing full environmental protection, enabling deployment in laundry management, logistics tracking, access control, and industrial asset management where tags face repeated physical stress.
Recommend for: Logistics · Access Control · Retail
3.8. LPM for Defense & Aerospace Electronics
Mission-critical electronics in defense and aerospace must withstand extreme temperatures, pressure differentials, vibration spectra, and chemical warfare agent exposure. Low pressure molding provides MIL-STD level environmental protection for PCBs, cable harnesses, and avionics connectors — with the added benefit of lighter weight compared to potting (reducing material consumption by up to 50%) and faster field-repair capability thanks to reworkable thermoplastic materials.
Recommend for: Defense · Aerospace · Marine
4. GLUMOLD Low Pressure Molding Machine Range
Gluditec’s GLUMOLD system includes a complete range of LPM machines — from handheld manual guns for R&D prototyping to dual-station production platforms and high-capacity screw extruders for mass manufacturing. All machines feature precision temperature control, stable gear-pump injection, and max operating temperature of 250°C with viscosity handling up to 20,000 cps.
| Model | Type | Tank | Closing Force | Best For |
|---|---|---|---|---|
| LPM-100G / 200G | Manual Gun | 200g | — | R&D, lab testing, prototyping |
| LPM-300D | Desktop | 1L | 50 kg | Trial production, small batches, budget-friendly entry |
| LPM-605H / 605V | Platform (Horizontal / Vertical) | 3L | 1,200 kg | Standard production, single station |
| LPM-900S | Double Station | 2 × 3L | 1,200 kg | Mass production, 1-operator dual output |
| LPM-800EU | CE Certified | 2 × 3L | 1,200 kg | European / export markets requiring CE |
| LPM-8000S | Screw Extruder | 12L | 1,200 kg | Continuous high-volume, color materials, prevents carbonization |
Each low pressure molding machine in the GLUMOLD lineup is designed to work seamlessly with GLUMOLD proprietary materials and aluminum mold sets — ensuring optimized compatibility and consistent results from prototype to full-scale production.
5. GLUMOLD LPM Materials — Engineered for Every Application
GLUMOLD provides 12+ standard grades of polyamide and polyolefin-based thermoplastic materials, each formulated for specific application requirements. All materials are one-component, solvent-free, renewable, and produce no harmful fumes during the molding process.
- General Purpose (HM3308A/B, HM3301): Fast cooling, good adhesion — ideal for consumer electronics and mobile device battery encapsulation.
- High Bond Strength (HM3306A/B, HM3307): Maximum adhesion for wire and connector protection in telecom and automotive applications.
- UV Resistant (HM3311A/B): UV aging resistance with wide temperature range (-40 to 120°C) — designed for vehicle wire packaging and outdoor installations.
- Battery-Safe (HM3312): Low softening point (130°C) for heat-sensitive battery encapsulation — new-generation Li-ion and LiPo cell protection.
- High Temperature (HM3309A/B, HM3313): Working temperatures up to 160°C with high hardness (45D–50D Shore) — for under-hood automotive and industrial environments.
- Custom Formulation: Gluditec can modify color, viscosity, hardness, and add functional additives (flame retardant, thermal conductivity, custom pigments) to match your specific requirements.
6. Key Factors for a Successful LPM Application
Purchasing a low pressure molding machine is only the first step. A successful LPM project requires careful optimization of five interconnected factors — and Gluditec’s engineering team supports you through every one of them:
- Pre-Preparation: Surface cleaning of components and pre-drying of resin pellets to ensure proper adhesion and eliminate moisture-induced bubble defects.
- Mold Design: Optimized injection flow paths, air venting, material waste reduction, and protection performance — including IP-rated sealing and light-through windows for sensors/LEDs.
- Molding Parameters: Fine-tuning injection temperature, pressure, speed, clamping force, and cooling time as an integrated system — because the same mold can produce different results with different settings.
- Material Selection: Matching the right GLUMOLD grade to your operating temperature, adhesion, hardness, UV resistance, and regulatory compliance requirements.
- Machine Selection: Choosing the right tank capacity, closing force, station configuration, and injection type based on your production volume and part complexity.
Download Our Full Technical Guide.
Our detailed guide on “Key Factors for a Successful LPM Application” covers mold design best practices, parameter optimization, common defect troubleshooting, and machine selection criteria. Contact us to receive a copy.
7. Why Gluditec — Your Complete LPM Partner
Most LPM providers offer only one piece of the puzzle — machines without materials, or materials without process support. Gluditec is different. We provide a fully integrated solution where every component is designed to work together, backed by engineering expertise accumulated over 11+ years and 20+ countries.
We build the concept mold and select optimal material based on your end-product requirements.
Flow simulation, iterative refinement, and validation before mass production begins.
Right machine, on-site installation, parameter optimization, and operator training.
Don’t want to set up an LPM line? We handle the entire process as your subcontractor.
8. Frequently Asked Questions About Low Pressure Molding Machines
What is a low pressure molding machine used for?
A low pressure molding (LPM) machine is used to encapsulate and protect sensitive electronic components — such as connectors, sensors, PCB assemblies, LED modules, battery packs, and wire harnesses — by injecting thermoplastic hot-melt material around them at low pressure (1.5–40 bar). The process creates a durable, watertight, and vibration-resistant protective layer without damaging the electronics.
How is low pressure molding different from potting or injection molding?
Low pressure molding sits between potting and injection molding. Unlike potting, which requires a housing, multi-step process, and hours of cure time, LPM completes encapsulation in seconds with no housing needed. Unlike high-pressure injection molding (500–2000 bar), LPM operates at 1.5–40 bar — gentle enough to protect sensitive electronics that would be destroyed by conventional injection pressures.
What IP rating can low pressure molding achieve?
Depending on mold design and material selection, low pressure molding can achieve IP67 (temporary immersion), IP68 (continuous immersion), and even IP69K (high-pressure, high-temperature washdown) protection ratings. The exact rating depends on connector seal design, wall thickness, and material adhesion to the substrate.
Can I use a low pressure molding machine for connector sealing?
Yes — connector sealing was the original application for which low pressure molding was developed. LPM creates watertight strain reliefs and mechanical bonds around connector interfaces, protecting solder joints and wire entry points. It is widely used for automotive connectors, industrial waterproof connectors, multi-pin harnesses, and cable assemblies across all industries.
What materials are used in low pressure molding?
LPM primarily uses polyamide-based and polyolefin-based thermoplastic hot-melt materials. These are one-component, solvent-free, and require no curing — they solidify upon cooling. Gluditec’s GLUMOLD material line includes 12+ grades optimized for different requirements: general purpose, high bond strength, UV resistance, battery-safe low-temperature, and high-temperature formulations.
How much does a low pressure molding machine cost compared to injection molding?
LPM machines and tooling cost significantly less than conventional injection molding systems. Aluminum molds for LPM cost a fraction of steel injection molds, and LPM machines have smaller footprints with lower energy consumption. For electronics encapsulation applications, the total cost per part with LPM can be 50% lower than potting and significantly lower than injection molding with secondary assembly.
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