Low Pressure Molding Machine
Complete LPM equipment for electronics encapsulation — from connectors and sensors to EV batteries and medical devices.
What is Low Pressure Molding?
Low pressure molding (LPM) is an encapsulation method that protects sensitive electronic assemblies — PCBs, connectors, sensors, LED modules, battery packs — by injecting thermoplastic hot-melt material at 1.5–40 bar. Unlike traditional potting or high-pressure injection molding, a low pressure molding machine is gentle enough to protect wire bonds and MEMS sensors, yet creates a robust, waterproof housing rated up to IP69K.
Performance
- Waterproof up to IP69K
- -50°C to 180°C range
- Vibration & shock resistant
Efficiency
- Cycle time: 10–60 seconds
- No cure time needed
- Single-component material
Sustainability
- Solvent-free, VOC-free
- REACH & RoHS compliant
- Reworkable & recyclable
How Low Pressure Molding Works
Where conventional potting requires up to seven process steps and 24-hour cure times, the entire LPM process completes in three steps.
What Can You Encapsulate with a Low Pressure Molding Machine?
Click the link on each card to view related products and solutions.
Connectors & Cable Assemblies
Watertight mechanical bonding around connector interfaces. Replaces heat-shrink and manual potting with a repeatable, automated single-step process. IP68 rated.
Automotive · Industrial · TelecomView related products →
Sensors & MEMS Devices
IP68 protection without damaging sensing elements or shifting calibration. LPM's gentle 1.5–40 bar pressure is critical for MEMS where minor stress causes drift.
Automotive · IoT · IndustrialView related products →
PCB & Circuit Board Protection
Full-body encapsulation replacing conformal coating + potting + housing with a single step. The material becomes the housing — eliminating separate enclosures entirely. Meets IPC-A-610 acceptability standards.
Electronics · Automotive · DefenseView related products →
LED Modules & Lighting
Thermal management and moisture protection with controlled light transmission. Low pressure ensures LEDs and solder joints are not displaced during molding.
Lighting · Signage · AutomotiveView related products →
Battery Packs & Energy Storage
Low-temperature encapsulation with HM3312 (130°C softening point). Reworkable — defective cells can be replaced without destroying the entire assembly.
EV · Power Tools · ConsumerView related products →
RFID Tags & Wearables
Minimal thickness (1mm with Skylining Technology) while maintaining full RF transparency. Ideal for laundry tags, logistics, access badges, and wearable monitors.
Logistics · Retail · HealthcareView related products →
Low Pressure Molding vs. Potting vs. Conformal Coating vs. Injection Molding
Complete side-by-side comparison across process, protection, reworkability, and cost parameters.
- Fastest cycle time — 10–60 seconds, no cure wait
- No housing needed — material becomes the enclosure
- Lowest component risk — safe for MEMS & wire bonds
- Fully reworkable with heat — repair & component recovery
- IP69K achievable with aluminum mold (days to make)
- Solvent-free, VOC-free — no ventilation needed
- Thermoplastic pellets have unlimited shelf life
- Requires upfront machine & mold investment
- Not ideal for very large encapsulation volumes (potting may suit)
- Limited to thermoplastic materials (polyamide / polyolefin)
- Mold redesign needed if part geometry changes significantly
- Material temperature (180–230°C) unsuitable for some heat-sensitive components — use HM3312 for low-temp grades
Gluditec solutions for each method:
| Parameter | Low Pressure Molding | Potting (Epoxy/PU) | Conformal Coating | Injection Molding |
|---|---|---|---|---|
| Process | ||||
| Pressure | 1.5–40 bar | Gravity / vacuum | Spray / dip / selective | 500–2,000 bar |
| Cycle Time | 10–60 seconds | Hours to 24h (cure) | Minutes + cure/UV | 10–60 seconds |
| Mold / Tool Cost | Low (aluminum 7075) | No mold | No mold (masking jig) | High (hardened steel) |
| Component Risk | Minimal — safe for MEMS | Moderate (exotherm) | Low — thin film only | High (pressure damage) |
| Housing Needed? | No — material = housing | Yes | Yes | Separate assembly |
| VOC / Solvent | None | Often present | Solvent-based types common | None |
| Protection Performance | ||||
| IP Rating | Up to IP69K | IP67 typical | IP54 typical (not full sealing) | IP67–IP68 |
| Temp Range | -50°C to +180°C | -40°C to +150°C | -65°C to +200°C | Depends on plastic |
| Mechanical Protection | Full — structural enclosure | Full — rigid block | Minimal — thin film only | Full — rigid housing |
| Vibration & Shock | Excellent — thermoplastic flexes | Moderate — rigid epoxy cracks | Poor — no structural support | Good — rigid plastics |
| Moisture Sealing | Excellent — inherent adhesion | Good — depends on housing | Moderate — conformal only, not waterproof | Good — requires gaskets |
| Strain Relief | Built-in mechanical bond | Partial | None | Separate component needed |
| Chemical Resistance | Excellent — polyamide resists automotive fluids | Excellent — broad range | Good (acrylic/silicone grade dependent) | Poor (ABS) to excellent (PEEK) |
| Reworkability & Lifecycle | ||||
| Reworkability | Yes — reheat to soften | No — destructive | Yes — solvent strip (acrylic) | No — destructive |
| Field Repair | Possible with heat gun | Not possible | Partial — re-coat possible | Not feasible |
| Recyclability | Yes — remelt and reuse | No — thermoset | No — thermoset or crosslinked | Limited |
| Material Shelf Life | Unlimited (pellets) | Months (resin expires) | Months (varies by chemistry) | Long |
| Cost & Production | ||||
| Tooling Lead Time | Days (aluminum CNC) | None | None (masking jig only) | Weeks–months (steel) |
| Material Waste | Low — runners remelted | High — excess cured | Low–medium (overspray) | Moderate |
| Cost per Part | Low–medium | Medium–high (labor) | Low (material) — medium with masking labor | Low at volume |
| Best Use Case | Full sealing + strain relief in one step | Large volumes, no housing available | PCB moisture & chemical protection, no full seal needed | High-volume rigid housings |
Key Factors for a Successful Low Pressure Molding Application
Purchasing a low pressure molding machine is only the first step. Success depends on optimizing five interconnected factors — and Gluditec's engineering team supports you through every one.
Pre-Prep
Surface cleaning, component pre-heat, resin pellet drying
Mold Design
Flow path, venting, cooling, IP sealing, skylining
Parameters
Temperature, pressure, speed, clamping, cooling
Material
Grade, temp range, hardness, UV, adhesion
Machine
Tank, force, station, injection type, volume
GLUMOLD Machine Lineup
Every machine shares: ±1°C temperature control, gear pump consistency, compatibility with polyamide & polyolefin up to 20,000 cps.
| Model | Type | Tank | Force | Injection | Best For |
|---|---|---|---|---|---|
| LPM-100G/200G | Handheld Gun | 100/200g | N/A | Manual | R&D, lab, trial runs |
| LPM-300D | Desktop | 1 L | 50 kg | Air pressure | Small batch, prototyping |
| LPM-605H/V | Horizontal / Vertical | 3L, 5L, 10L, 20L | 1,200 kg | Gear pump | Single-station production |
| LPM-900S | Dual-Station | 2×3 L | 1,200 kg | Gear pump | Mass production, 1 operator |
| LPM-800EU | CE Platform | 2×3 L | 1,200 kg | Gear pump | EU / export compliance |
| LPM-8000S | Screw Extruder | 12L, 20L | 1,200 kg | Screw pump | High-volume, color material |
Why Gluditec — Your End-to-End LPM Partner
Unlike competitors who sell only machines or only materials, Gluditec provides a fully integrated solution — 11+ years, 20+ countries, electronics to aerospace.
Mold Design & Concept
We design the concept mold and select the optimal material based on your end-product performance — not just the part shape.
Mold Evaluation & Modification
Flow simulation, iterative refinement, and validation to ensure consistent quality before mass production.
Machine + Process Setup
Right machine, on-site installation, parameter optimization, and operator training — all included.
Contract Manufacturing
Don't want to set up a line? Gluditec handles the entire LPM process as your subcontractor.
Frequently Asked Questions
What is an LPM machine used for?
How is LPM different from potting or injection molding?
What IP rating can LPM achieve?
What materials work with GLUMOLD machines?
Can GLUMOLD machines be customized?
Explore GLUMOLD Products
Browse our full range of low pressure molding equipment and mold sets — all engineered for reliable electronics encapsulation.
Ready to Evaluate LPM?
Contact our engineering team for material samples, process consultation, or a machine quotation tailored to your production.
Contact Us — info@gluditec.comwww.gluditec.com | GLUMOLD Solution | Gluditec Co., Ltd