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GLUMOLD – LOW PRESSURE MOLDING SOLUTIONS

GLUMOLD is low-pressure molding (LPM) technology from Gluditec – Glue & Dispensing solution provider. GLUMOLD is a method used to shape and safeguard electrical and electronic components, such as printed circuit boards or sensors, from vibrations, shocks, and impacts. LPM provides insulation against heat, cold, moisture, weather conditions, and electrical energy. This technique is cost-effective, saves space, and can be customized. It is also employed to create grommets and strain reliefs for connectors. The primary materials used in LPM are amorphous thermoplastic polyamides and polyolefin due to their favorable viscosity spectrum and wide application temperature range from -50 to 180ºC. Some typical applications are but are not limited to:

GLUMOLD - GLUDITEC Low Pressure Molding Technology_compressed

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