GLUDITEC Underfill Solution
Gluditec Underfill Adhesives & Equipment: Enhancing Reliability and Performance in Modern Electronics
In the rapidly evolving electronics industry, Gluditec offers advanced underfill adhesives and equipment designed to meet the demands of thinner, less rigid PCBs. Our products provide superior shock resistance and enhance device reliability. Engineered to meet high-temperature and lead-free assembly requirements, Gluditec underfill resins deliver low stress, exceptional adhesion, and remarkable flexibility. With low dielectric constants ideal for microchip bonding, our resins excel in underfill applications, offering excellent chemical
resistance and reworkability. Suitable for various electronic components, including CSPs and micro BGAs, Gluditec’s solutions ensure optimal fluidity and thermal shock resistance, making them the ideal choice for modern IC packaging needs.