PCB Assembly

The introduction of novel substrate materials has presented flip-chip technology with fresh obstacles. Engineers are tasked with resolving issues stemming from the disparity in thermal expansion coefficients between the die and substrate to prevent the...

Optimize your underfill rework process with these comprehensive steps Step 01: Component Stripping Begin by heating  he solder joint to a temperature higher than the reflow temperature to soften the adhesive, minimizing substrate damage. Once...

What is Soldering Flux? IPC categorizes a flux as a chemical and physical agent that enhances the ability of molten solder to wet a metal surface by eliminating oxide or other surface films from the...