Without underfill, the life expectancy of a product would be significantly reduced due to the cracking of interconnects.

Underfill is nowadays indispensable step in electronics manufacturing process thanks to its practical benefits for end-products. Addition to durable epoxy adhesive, an effective automation underfilling process is necessary to achieve the repeatability and high increase yield. Watch our video for basic information of this application and take a look at our dispensing solution as follows:

How can we support you?

If you need any assistance, do not hesitate to contact us