To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections or individual components on the substrate. Different methods ranging from “glob top” to “dam and fill” and “flip chip underfill” have been developed for this purpose.

Things would not be the same today without them. The PCB (or circuit board) is now the most frequently used carrier and connecting component for electronic components. There are practically no limits to its use. In addition to computers, cars and airplanes, PCBs are also used in household appliances and communication devices, in security electronics and medical devices. For example, to ensure that airbags deploy reliably and on-board computers in airplanes operate correctly, the intricate electronics on the PCB must be permanently protected against moisture, dirt, impact, chemicals and other damaging influences. This is just one of the tasks provided by potting. Different methods have been developed based on the particular electronic components (sensors, processors, etc.) to be potted or the potting function(s) required.

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