When considering a potting process, a reliable material preparation is a key
The important criteria for potting depend on different factors such as the material used, the workpiece design or the curing process selected. Before the actual potting can happen, however, it is always important to employ a material preparation and feed system suited to the task. To achieve high quality, reproducible potting results, it is important to consider parameters such as viscosity, temperature, bubble-free application, filler concentration and the reaction form of the medium. In this case, state-of-the-art systems with heavy-duty feed pumps and sophisticated pressure and vacuum controls provide the necessary reliability.
The filling or potting process involves filling a pre-specified mold, such as a housing, with a low-viscosity material. The process is applied wherever sensitive electronic components, such as wired circuit boards or power modules, need to be protected from chemical, corrosive or mechanical influences. Potting can even help to reduce thermal loads, dissipate heat and provide camouflage or fire hazard protection. 1K or 2K PU, epoxy or silicone based potting compounds are used which have functions and properties (color, hardness level, material thickness, temperature stability) that can be tailored precisely to the particular application.
Fully potted or encapsulated components are used in standard household appliances as well as in the military and arms manufacturing sectors, in the electronics industry and in the lighting industry. For example, LEDs are frequently potted using PU or silicone based media in order to ensure their long life and excellent lighting quality. Another major area of application for potting is the automotive industry. In this field, components such as control units for engine, transmission, steering and driving assist systems or complete power semiconductor modules for electric motors are potted using suitable casting resins.
A frequently used type of potting process is what is known as “dam and fill”, where two potting materials with differing viscosities are used. Typically this process is used to protect fragile structures on circuit boards.