Fiber optic connector bonding
High crystallized glass fiber and fiber optic connector
High-temperature resistance wafer level sealing with GLUDITEC Two-component epoxy resin
The high crystallized glass fiber and fiber optic connector bonding material must provide a strong bond for mechanical stability and cure effectively at low temperatures (80°C for 30 minutes, 150°C for 1 minute) with minimal shrinkage (2.1%) to ensure dimensional stability. It should exhibit low ionic volatilization to prevent corrosion and maintain signal integrity, along with low VOCs for environmental safety. The adhesive needs to reliably withstand harsh conditions, including thermal cycling, thermal shock, high temperature,
and humidity while being safe to handle with a low-irritant, non-toxic formula. The material must be transparent for applications requiring optical clarity to avoid interfering with signal transmission. Additionally, it should offer good electrical insulation properties, be compatible with glass fibers and other connector materials, maintain its properties over time for durability, and be user-friendly and compliant with industry standards and certifications.
GLUDITEC Bonding Solution
| No | Part number | Chemical Base | Feature |
| 1 | ET5360 | Two part Epoxy | Low viscosity series |
| 2 | ET5310 | Two part Epoxy | Medium-high thixotropic index, anti-sag series |
| 3 | ET5330 | Two part Epoxy | Low viscosity and black color series |
| 4 | ET5350 | Two part Epoxy | Low viscosity and low-temperature curing series |
1. Low temperature curing at 80°C*30min, 150°C*1min
- Energy Efficiency: Reduces energy consumption compared to high-temperature curing, saving on operational costs.
- Time Efficiency: Quick curing at 150°C for 1 minute allows for faster production cycles, increasing throughput.
- Versatility: Allows for use in applications sensitive to high temperatures, protecting delicate components from heat damage.
2. Low volume shrinkage 2.1%
- Dimensional Stability: Ensures that the bonded components maintain their original dimensions, critical for precision applications.
- Stress Reduction: Minimizes internal stresses in the adhesive layer, preventing cracks or deformations over time.
- Reliability: Enhances the long-term reliability of the bond, which is important for optical and electronic components.
3. Low ionic volatilization
- Corrosion Prevention: Reduces the risk of corrosion in electronic components, extending their lifespan.
- Signal Integrity: Maintains the purity of optical and electronic signals by preventing contamination.
- Reliability: Ensures stable performance in harsh environments by minimizing ionic migration.
4. Comply with reliability test, thermal cycle, thermal shock, high temperature, and high humidity, high-temperature heating test
- Durability: Demonstrates the adhesive’s ability to withstand extreme conditions, ensuring long-term performance.
- Quality Assurance: Meets industry standards for reliability, instilling confidence in product quality.
- Versatility: Suitable for use in various environmental conditions, broadening application possibilities.
5. Low-volatile and low-irritant formula, no harm to hands, no allergies to skin
- Safety: Provides a safer working environment for users, reducing health risks.
- Comfort: Enhances user comfort during application, encouraging proper use and handling.
- Compliance: Meets safety regulations and standards for occupational health.
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