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Chip underfill adhesive process, epoxy resin is typically applied along the L-shaped path on two adjacent sides of the wafer

During the chip underfill adhesive process, epoxy resin is typically applied along the L-shaped path on two adjacent sides of the wafer. Here are the steps involved:

Storage Conditions: The product should be stored according to manufacturer specifications, often in a low-temperature environment ranging from -20°C to -40°C. Before use, it’s recommended to place the product in a refrigerator at approximately 2°C to 10°C for 1 to 2 hours, then allow it to return to room temperature (20°C to 30°C) for at least 1 hour, ideally in a dehumidified area, to ensure the adhesive returns to 25°C before application.
Preheating Circuit Board: Before dispensing and filling, the circuit board beneath the chip should be preheated to facilitate adhesive flow, adhering to the recommended temperature range specified by the adhesive’s physical properties.
Initial Dispensing: Begin by dispensing the adhesive along the I-shaped or L-shaped path on the BGA wafer, with dots of glue applied approximately 0.3 to 0.5mm from the edge of the BGA wafer.

Chip Under Fill Adhesive

Second Dispensing: Once the adhesive penetrates the bottom of the BGA, perform a second dispensing with a slightly reduced amount of glue. Ensure the adhesive spreads to the opposite side of the BGA, forming a slope to cover the chip, thus minimizing air bubbles or voids.
Curing Process: After confirming the completion of the underfill, place the circuit board in an oven for reaction curing at the specified temperature outlined by the product guidelines.

By following these steps meticulously, manufacturers can ensure proper application and curing of chip underfill adhesive, resulting in robust encapsulation and reliable performance of electronic devices.

GLUDITEC introduces wafer & chip underfill products with suitable features & benefits to solve these challenges:

GLUDITEC Underfill Adhesive

Low Viscosity and High Fluidity: Enhance application efficiency with chip underfill adhesive featuring low viscosity and high fluidity, enabling easy operation during dispensing and filling processes.
Non-Greasy, Low Gloss Finish: Ensure a pristine appearance post-curing with chip underfill adhesive that yields a hardened product surface free from greasiness and excessive gloss, enhancing the visual appeal of electronic components.
Repeated Flexibility and Fatigue Resistance: Ensure long-lasting performance with chip underfill adhesive offering a high degree of repeated flexibility and fatigue resistance, effectively preventing cracking and ensuring the durability of electronic assemblies.

Exceptional Flexibility with Low Stress: Safeguard electronic components from excessive stress and potential damage with chip underfill adhesive characterized by excellent flexibility, providing optimal protection during thermal cycling and mechanical stress.
Quick Curing for Enhanced Efficiency: Maximize production efficiency with chip underfill adhesive that offers rapid curing capabilities, allowing for quick turnaround times and increased capacity utilization in manufacturing processes.
Reworkability and Repairability: Facilitate ease of maintenance and repair with chip underfill adhesive that can be reworked without causing damage to pads. Effortlessly remove residual glue for seamless reapplication, enabling efficient repair processes and minimizing downtime.