1K Epoxy
Handling thick liquid with or without abrasive metal filler
Precision fluid dispensing as well as the highest levels of process control
Single-part epoxy adhesives will usually be used without metal filler in the general assembly. They form excellent structural bonds to various materials including metals, composites, wood, and even some plastics. Single-part epoxies are ideal for use in heavy wear-and-tear applications such as bonding tungsten carbide tools & machinery. This process requires a specific motion control system customized for each production line and a high-precision liquid control system to save wasting materials cost. Single component epoxy is also used in underfill application which is the popular protecting & reinforcing method in PCBA process.
Thermally and electrically conductive epoxy-based fluids with metal filler demand precision dispensing as well as the highest levels of process control to keep waste to a minimum. These single-component adhesives are required to mechanically bond the die to the substrate or encapsulate the electronic component, to make an electrical ground plane connection, and to conduct heat away from the die. These fluids tend to have a short pot life and may be temperature sensitive. Filters in these fluids can easily clog typical valves.
Using our dispensing system for single-component epoxy can enhance the speed of production and deliver high throughput. The exceptional accuracy delivers significant cost-of-material savings.
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